News On Printing Machine

With the arrival of spring, the shipment work of Kunshan Oulet Printing Machinery Company has also ushered in its peak period.This season not only heralds the recovery of all things, but also symbolizes that the shipment volume of Oulight Company is rising like bamboo shoots.In this golden season, Kunshan Oulet Printing Machinery Co., Ltd. is busy preparing for a grand shipment feast.In this era full of opportunities and challenges, Kunshan Oulet Printing Machinery Co., Ltd. will continue to adhere to the 'customer-centered' service concept, continue to innovate and progress, and provide customers with better products and services.

A sensor is a device used to sense and detect physical information and convert it into electrical signals.Due to its advantages of miniaturization, digitization, and intelligence, it is widely used in automobile industry batteries, medical fields (adding blood glucose meter links), environmental testing, aerospace and other application fields.Sensors can be divided into integrated sensors, thin film sensors, thick film sensors, ceramic sensors, etc. according to process classification.Among them, ceramic sensors are sensors made of ceramic materials. Because ceramic materials have the advantages of high sensitivity, good linear response, high temperature resistance, corrosion resistance, and high strength, they have become an ideal material for making ceramic sensors in recent years.In the production process of ceramic sensors, the first step is to process the ceramic materials: ① Sieve the ceramic powder to ensure uniform particles.② Processed into the required shape and size, the most common methods are molding, injection molding, die casting and extrusion.③Drying and sintering, the time and temperature need to be determined according to the ceramic

Ceramic copper clad laminate refers to manufacturing a circuit board (PCB) by attaching a layer of copper foil to the surface on a high thermal conductivity ceramic substrate. Its characteristic is that the ceramic-covered copper foil can provide better thermal stability and mechanical strength, so It can be used at high temperatures and pressures, making it an ideal material in high-end electronics such as satellites, aerospace electronics and power electronics.In the process of making circuit boards from ceramic copper clad laminates, printing solder resist is an important step.Thick film screen printing technology is usually used to print solder mask ink or photosensitive solder mask on the surface of the circuit board.After printing, it needs to be heated and cured, and then a chemical corrosion solution is used to deeply etch the parts other than the printed layer to remove unnecessary copper and retain the copper foil required for the circuit, thereby forming a protective layer to prevent the circuit board from being damaged. Components and circuits are short-circuited and corroded, improving the reliability and stability of the circuit board.Process flow 1. First clean the surface of the circuit board

1. Introduction to the pad printing process. Pad printing is an indirect printing technology with a recessable rubber head. By making a specific steel plate pattern, the printing technology uses the rubber head to transfer the etching pattern content to the product. It has now become a printing technology for various object surfaces. A major method of printing and decoration.Principle: The process is very simple. First, the designed pattern is etched on the printing plate, the etching plate is coated with ink, and then most of the ink is transferred to the printed object through the silicone head.Main production problems and solutions: 1. Pad printing font burrs: After pad printing, small feather-like burrs appear on the edges of the fonts, making the fonts enlarged; the ink is too thin and does not dry quickly enough; the humidity is too high; solutions: A.Reduce the amount of ink thinner used; make the ink dry faster; B.The rubber head is equipped with a hot air blowing device; C.Reduce the humidity in the workshop and reduce the etching depth of the steel plate; 2. Deformation of the pad printing pattern: Graphic distortion and deformation appear on the surface of the pad printed product, mostly in the pad printing area.